Description
PERMABOND ET538 is a structural, room temperature curing epoxy adhesive that has excellent adhesion to a wide variety of surfaces such as wood, metal, ceramics and many plastic and composite materials. It exhibits good resistance to petrol, oils and water and has an extended cure time making it suitable for larger applications and batch production processes. Its thixotropic “non-slump” nature makes it suitable for gap filling or vertical application.
Features & Benefits
- Adhesion to a wide variety of substrates
- Full cure at room temperature
- Easy to apply
- High shear and peel strength
- Good impact strength
- Good chemical resistance
- Non-drip rheology
Physical Properties of Uncured Adhesive
ET538A | ET538B | |
Chemical Composition | Epoxy Resin | Polyamine Hardener |
Appearance | White | Dark Grey |
Viscosity @ 25°C | 20rpm: 50,000- 100,000 mPa.s (cP)
2.5rpm: 150,000- 300,000 mPa.s (cP |
20rpm: 20,000- 40,000 mPa.s (cP)
2rpm: 30,000- 90,000 mPa.s (cP) |
Specific Gravity | 1.1 | 1.4 |
Typical Curing Properties
Mix Ratio | 1:1 by volume
100:130 by weight |
Maximum gap fill | 5 mm (0.2 in) |
Usable / pot life @ 23°C | 120-150 mins |
Handling time @ 23°C | 3-5 hours |
Working strength @ 23°C | 24 hours |
Full cure @ 23°C | 72 hours |
Typical Performance of Cured Adhesive
Shear strength*
(ISO4587) |
Steel: 18-20 N/mm² (2600 – 2900 psi)
Zinc: 17-20 N/mm² (2500 – 2900 psi) |
Peel strength (aluminium)
(ISO4578) |
60-80 N/25mm (13-18 PIW) |
Hardness
(ISO868) |
70-80 Shore D |
Elongation at break
(ISO37) |
4-8% |
Glass transition temperature Tg | 45-55°C (113-131°F) |
Dielectric strength | 15-25 kV/ mm |
Thermal conductivity | 0.55 W/(m.K) |
*Strength results will vary depending on the level of surface preparation and gap.
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