Description
PERMABOND® ES578 is a single-part heat cured epoxy adhesive with excellent adhesion to metal surfaces, ceramics as well as composite materials. ES578 provides excellent thermal conductivity and bond strength. ES578 was designed for applications requiring heat dissipation such as bonding aluminum heat sinks to ceramic headers. The cured adhesive has been designed to meet the fire retardancy requirements of UL94 V-0.
Features & Benefits
- Very good thermal conductivity
- Excellent resistance to vibration
- Easy to use – no mixing required
- High shear and peel strength
- High temperature resistance
- Good resistance to chemicals
- Electrically insulating
Physical Properties of Uncured Adhesive
| Chemical composition | Epoxy resin |
| Appearance | Black |
| Viscosity @ 25°C | 600,000 to 800,000 mPa.s (cP) |
| Specific Gravity | 1.6 |
Typical Curing Properties
| Flow at hight temperature | Flowing |
| Maximum gap fill | 5 mm (0.2 in) |
| Cure speed (oven)* | 130° C (266°F): 75 minutes
150°C (300°F): 60 minutes 170°C (338°F): 25 minutes |
| Cure speed (induction) | <3 minutes |
*Actual cure times will depend on the time it takes for the adhesive to reach this temperature – for example, large assemblies or a crowded oven will require longer to reach full cure. Alternative, quicker methods of curing include induction, hotplates, infrared lamps and hot-air guns.
Typical Performance of Cured Adhesive
| Shear strength*
(ISO4587) |
Steel 27 – 41 N/mm² (4000 – 6000 psi)
Aluminium 17 – 31 N/mm² (2500 – 4500 psi) Zinc 14 – 27 N/mm² (2000 – 4000 psi) |
| Hardness (ISO868) | 80-85 Shore D |
| Coefficient of thermal expansion | 45 x 10^-6 mm/mm/°C (below Tg) |
| Thermal conductivity | 1.3 W/(m.K) |
| Dielectric strength | 40-45 kV/mm |
| Glass transition temperature
(Tg – DSC) |
105°C (220°F) |
*Strength results will vary depending on the level of surface preparation and gap
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