We’re all set to host an educational Lunch and Learn presentation on Tuesday, February 24^th.  The seminar will feature Lord Corporation’s brand new 810/20 Low Read-Through Adhesive, a long anticipated bonding solution tailored for the Sign Industry. In association with Lord Corporation and Yorston & Associates, we invite Sign Industry professionals and their peers to learn about new solutions for bonding ACM panels and thin gauge metals. The Lunch and Learn, which will include lunch and refreshments, will begin at 11 AM and take place at our office at 410 Pike Road, Huntingdon Valley, PA.

Our ultimate goal is to better inform our friends and colleagues of the new products and solutions that have the ability to make their jobs easier. Lord’s 810/20 Low Read-Through is a great improvement upon the often maligned byproduct of high read-through alternatives, and we’re glad to introduce this new product along with its numerous features and benefits.

Professionals in the Sign Industry are always looking for low maintenance, tough and flexible bonds for metal-to-metal and metal-to-composite/plastics surfaces. Lord’s new 810/20 Low Read-Through Adhesive with Accelerator 20 delivers all of the above with several other added benefits. Lord’s recent release requires very little substrate preparation, no bond-line read-through, minimal shrinkage, and 90% to full cure within just one hour! The non-sagging, two-component adhesive also has excellent peel strength and is available in 400 mL, 200 mL, 50 mL, and 5 gallon pails and drums. We are a trusted distributor for Lord Corporation and are proud to offer Lord’s 810/20 Low Read-Through adhesive.

See our attached Lunch and Learn PDF for more information.