Description
MP 54190 GR is a medium viscosity polyamide/epoxy adhesive recommended for bonding applications where high shock impact resistance and peel resistance are desired. This 1 : 1 ratio, two part adhesive is easily mixed and cured at room temperature and develops tough, strong bonds to a wide variety of materials, including metals, glass, ceramics and plastics. Fully cured MP 54190 GR bonds offer superior thermal shock resistance, mechanical, electrical, electrical and impact dimensional stability and resistance to water, weather, oxygen and ozone, most petroleum products, mild acids and alkalis and many other chemicals.
Physical Properties:
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