Description
Chem-Set Substrate Bonder is a two-part, unfilled, room temperature cure, urethane adhesive designed for bonding of Quartz, Solid Surface, Natural and Engineered Stone to wood, particle board, plywood or other substrates. The Substrate Bonder is strong but highly flexible in nature with a rapid cure. It is especially formulated for a 1:1 mix ratio for use in side-by-side cartridges, or to be used by hand mixing, or use with Meter Mix Equipment. Substrate Bonder is Low VOC and is non-flammable. A handling cure is normally achieved at room temperature within 30 minutes.
Characteristics:
- Work Time: 7 to 10 minutes (at 75°F/ 24°C)
- Full Cure: 20 to 30 minutes
- Operating Temp. 60° to 80° F (16° to 27° C)
- Mixed Density: 1.3 g/L
- Viscosity: Resin (Part A): 2,000 CPS; Hard (Part B): 45,000 CPS
- Color: Resin (Part A): Clear; Activator (Part B): Amber
- Mixed Color: Light Amber
- Mix Ratio: 1 Part A to 1 Part B (1:1)
- Lap Shear Strength: >100 PSI
- Elongation: >100%
- Dielectric Constant 3.6 (at 25C, 100Hz)
- Shelf Life: 12 Months
- VOC Content: 0% by weight
Applications:
- Substrate Attachment
- Wood, MDF
- PVC, HPL, ABS
- Solid Surfaces
- Quartz Surfacing
- Granite
- Wall Panels
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